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With the rapid development of the electronic components industry, LCD screens are also used in various industries, such as automobiles, small home appliances, disinfection machines, beauty equipment, medical equipment, and other fields. Many salesmen often encounter customer inquiries about what are the common ways of connecting LCD and IC and how the difference is, what are the advantages and disadvantages of the LCD screen connection? Ltd. technical staff to give a brief introduction, I hope it will help you.

What are the LCD connection methods and how are they different, there are mainly the following five connection methods?

(1) SMT Connection

SMT is what it means: the English abbreviation is “Surface mount technology”, Chinese: surface mount technology, which is a more traditional installation method.

Advantages: high reliability.

Disadvantages: large size, high cost, limiting the miniaturization of LCM.

(2) COB Connection Method

COB is what it means: the English abbreviation is “Chip On Board”, Chinese: the chip is bonded (Bonding) on the PCB, is a chip production process in a way to hit the line, generally used for packaging before the chip internal circuit with gold wire and package pin connection. Generally, after bonding (i.e., after the circuit is connected to the pins), the chip is encapsulated with a black gel, while using advanced external packaging technology COB, the process of this process is to have tested the wafer implanted on a special circuit board, and then the wafer circuit is connected to the board with gold wire, and then the organic material with special protection function after melting is covered to the wafer to complete the post-encapsulation of the chip.

Advantages： PCB boards and other materials can be eliminated, which can greatly reduce the volume of the module, while also reducing costs in terms of price.

Disadvantages： Packaging density is slightly smaller than TAB and flip-chip soldering technology. The need for another welding machine and packaging machine, the production technology requirements are extremely strict, such as sometimes the speed can not keep up with the PCB placement of environmental requirements more stringent and can not be maintained.

Development trend: As IC manufacturers in LCD control and related chip production is reducing the production of QFP (SMT a) package, so the traditional SMT connection in future products will be gradually replaced.