The latest research study "Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028" offers a comprehensive analysis of the industry, which comprises insights on global advanced packaging market Share. The global advanced packaging market size reached US$ 37.1 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 74.7 Billion by 2028, exhibiting a growth rate (CAGR) of 11.2% during 2023-2028.

Advanced packaging is a technique that involves connecting and assembling various components, such as wafers, logic units, and memory, within metallic parts to safeguard them from physical damage and corrosion during semiconductor manufacturing. This process combines different methods, including 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package, after considering various factors like power consumption, size, operating conditions, and cost. Advanced packaging can enhance the functionality of electronic devices, reduce power consumption, improve connectivity, and protect chips from mechanical stresses and vibrations. Hence, advanced packaging is extensively used in various electronic devices.

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Advanced Packaging Market Trends and Drivers:

The advanced packaging market is experiencing growth due to the increasing demand for consumer electronics such as wearables, smartphones, laptops, and miniaturized devices. This trend is accompanied by the expanding applications of packaging in the electronics sector. Manufacturers are using advanced packaging solutions to accomplish delicate patterning in wafers and reduce the sizes of integrated circuits in semiconductors, further driving market growth. Leading companies are relying on advanced packaging techniques to optimize systems in nano-sized robotic surgery equipment and sophisticated wearable devices. The adoption of fan-out wafer-level packaging is also growing due to its numerous benefits, including superior thermal performance, increased wafer-level yield, easier packaging systems, and the acceptance of three-dimensional (3D) circuits. These factors are expected to positively impact the advanced packaging market in the coming years.

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Advanced Packaging Market 2023-2028 Analysis and Segmentation:

Competitive Landscape:

The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.

Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).

The report has segmented the market on the basis of type and end use.

Breakup by Type:

  • Flip-Chip Ball Grid Array
  • Flip Chip CSP
  • Wafer Level CSP
  • 5D/3D
  • Fan Out WLP
  • Others 

Breakup  by End Use:

  • Consumer Electronics
  • Automotive
  • Industrial
  • Healthcare
  • Aerospace and Defense
  • Others

Breakup by Region:

  • North America: (United States, Canada)
  • Asia Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
  • Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
  • Latin America: (Brazil, Mexico, Others)
  • Middle East and Africa

Key highlights of the report:

  • Market Performance (2017-2022)
  • Market Outlook (2023- 2028)
  • Porter's Five Forces Analysis
  • Market Drivers and Success Factors
  • SWOT Analysis
  • Value Chain
  • Comprehensive Mapping of the Competitive Landscape

If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.

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